BIS’s Hong Kong innovation hub launches trade finance competition

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The Bank for International Settlements’ innovation hub in Hong Kong has launched a new project to develop technology solutions for problems relating to trade finance.

Firms have been invited to take part in what the BIS is calling a ‘TechChallenge’ to “enhance trade finance mechanisms”.

To help firms develop their pitches, the BIS has created three “problem statements”. The first encourages the creation of products that will help existing trade finance platforms connect to one another and

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